发明名称 |
METHOD OF MAKING A PRINTED CIRCUIT BOARD |
摘要 |
A method of making a plate through hole printed circuit board, comprises the steps of: a) forming conductive circuit elements (10) on two opposed faces of a paper phenolic containing substrate (11); b) coating the substrate and circuit elements with a de-sensitising material (12); c) forming holes (13) through the substrate, each hole passing through a circuit element on each of the opposed faces of the board; d) treating the board to render the substrate exposed in the holes receptive to the action of a metallic plating solution; e) removing the de-sensitising material; f) printing an acid-resist mask (14) on to both faces of the board, the mask leaving exposed only a small area of the board surrounding, each hole therethrough, and g) treating the board with an electroless nickel-plating solution to deposit nickel (15) in the holes to the desired thickness to provide an electrical connection through each hole between two opposed conductive circuit elements.
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申请公布号 |
CA2177708(A1) |
申请公布日期 |
1995.06.08 |
申请号 |
CA19942177708 |
申请日期 |
1994.12.02 |
申请人 |
KNOPP, JOHN FREDERICK DAVID |
发明人 |
KNOPP, JOHN FREDERICK DAVID |
分类号 |
H05K3/42;(IPC1-7):H05K3/42 |
主分类号 |
H05K3/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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