Semiconductor wafer testing appts.

摘要

The arrangement has a contact card for contacting semiconducting chips on the wafer, a test signal generation circuit electrically connectable to the card and a holder for lowering the contact card. The holder and contact card are mounted above the wafer. The holder has an outer ring (5) fixed to a measurement station housing and an axially movable inner ring (4) which can be moved away from the wafer. The contact card can be radially inserted into the inner ring, which has guide rails for the card on its side facing the wafer and a multipole adapter element which can be electrically coupled to the card and can be connected to the circuit. A latch holds the inner ring in the outer ring.