Resin composition for extrusion moulding.

摘要

A resin composition for extrusion molding which has a melt flow rate (MFR) of from 0.5 to 30 g/10 min., having (A) 1 to 80 parts by weight of an ethylenic polymer which gives an endothermic peak in a temperature range of from 80 to 120 DEG C in a temperature rise thermogram as measured by a differential scanning calorimeter, has a melt flow rate (MFR) of from 0.5 to 50 g/10 min., and is prepared by high-pressure radical polymerization, (B) 5 to 80 parts by weight of a copolymer of ethylene and an alpha -olefine containing 3 to 12 carbon atoms which gives at least one endothermic peak in a temperature range of from 110 to 130 DEG C in the temperature rise thermogram as described above, has a melt flow rate (MFR) of from 0.5 to 30 g/10 min. and a density of from 0.900 to 0.935 g/cm<3>, and (C) 5 to 70 parts by weight of the copolymer of ethylene and an alpha -olefine containing 3 to 12 carbon atoms which has a melt flow rate (MFR) of from 0.5 to 30 g/10 min. and a density of from 0.870 to 0.920 g/cm<3> in an unannealed state, and gives no endothermic peak at temperatures above 110 DEG C in the temperature rise thermogram as described above, and in which a ratio of a main component is not less than 80 %; which gives a packaging material having significantly improved properties such as heat sealability at low temperature, heat-sealing strength, hot tacking property and bag breaking strength, and exhibits an excellent extrusion processability such as film forming property and extrusion loading.