发明名称 CURING APPARATUS
摘要 PURPOSE:To provide a curing apparatus not occupying a large installation area, capable of setting a high temp. chamber to desired set temp. in a short time and capable of being used regardless of the lot quantity of semimanufactured products immediately after resin packaging and excellent in economical efficiency and general-purpose properties. CONSTITUTION:In a curing apparatus holding a semimanufactured product S to which resin packaging is applied to a predetermined high temp. state for a specific time to cure the same, a pluality of thermostatic chambers 31 having heaters 37 and opening and closing doors 38 individually provided thereto and mutually provided in parallel, the cooling chamber 32 provided in parallel to the thermostatic chambers and provided with a cooling means 32A to perform cooling, feed means 40,41,42,43 appropriately feeding in and out the semimanufactured product S with respect to the thermostatic chambers 31 and the cooling chamber 32 and a control unit 50 are provided.
申请公布号 JPH07144329(A) 申请公布日期 1995.06.06
申请号 JP19930295107 申请日期 1993.11.25
申请人 TAMUSU TECHNOL KK 发明人 YONEZU MINETOSHI;SAKAMOTO HIDEO
分类号 B29C35/02;B29L31/34;H01L21/56;H01L23/08;(IPC1-7):B29C35/02 主分类号 B29C35/02
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