| 摘要 |
A method for washing a group of semiconductor wafers in which a first support arrangement is provided for supporting the wafer group to be immersed in a solution, with a second support carrying the wafer group to the treatment vessel. The second support can be provided, for example, in the form of a fork arrangement, and the wafer group is transferred from the second support to the first support for treatment or washing in the treatment vessel. After the wafer group is pulled from the treatment solution, the wafer group is transferred from the first support to the second support and carried outside of the treatment vessel and transferred from the second support. Water is then sprayed onto the second support by moving a water washing nozzle along support rod(s) of the second support, and by blowing a drying gas along the second support while the second support is not carrying wafers thereon, and the next wafer group can then be supported by the clean second support.
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