| 摘要 |
PURPOSE:To prevent the occurrence of reflow cracks which are generated by a new mechanism by mechanically restricting the relative displacement of corner sections of a resin against other members and reducing the deformation of the resin in a crack developing direction. CONSTITUTION:Hook leads 15 are protruding from the central parts of side faces of a tab 11 for mounting a semiconductor element 2 with a die bonding agent layer 4 in between and the leads 15 are bent toward the circuit forming surface of the element 2 so that the leads 15 can prevent the occurrence of reflow cracks by mechanically restricting the relative displacement of corners of a sealing resin 5 against other members even when the layer 4 is stripped off at a high temperature during the reflowing process. Therefore, the deformation of the resin 4 in a crack developing direction can be reduced and the occurrence of reflow cracks generated by a new mechanism can be prevented. |
