发明名称 HEAT TREATMENT METHOD
摘要 <p>PURPOSE:To solve problem of a glass base board shrinkage or deflection by holding the base board approximately horizontally, and heating it. CONSTITUTION:A reaction tube 11 made of quartz, a base board holding means 12, and a base board 13 arranged horizontally constitute a device for use with the heating processing method, which is further fitted with a heater for applying heat to the reaction tube 11 externally. A means to supply a certain gas to the reaction tube is equipped, and also a means to move the base board holding means to the outside from the reaction tube is furnished. The glass base board is held jorizontally for preventing it from deflecting and losing its flatness through a heating process. This configuration works effectively in the case which requires a process where a temp. over a distortion point is applied to the base board. If the base board is not to be shrunk in the heating process, it should previously undergo a heating process (pre-heating) to make a shrinkage so that shrinking in the later heating process is reduced.</p>
申请公布号 JPH07146470(A) 申请公布日期 1995.06.06
申请号 JP19930256569 申请日期 1993.09.20
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 CHIYOU KOUYUU;TAKAYAMA TORU;ADACHI HIROKI
分类号 G02F1/1333;G02F1/13;G02F1/136;G02F1/1368;H01L21/22;H01L21/324;H01L21/336;H01L29/78;H01L29/786;(IPC1-7):G02F1/133 主分类号 G02F1/1333
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