发明名称 Computer chip mounting hardware for heat dissipation
摘要 A computer chip mounting hardware includes a mother board having two electrical connectors at the top; a sub PC board having two electrical connectors at the bottom respectively connected to the electrical connectors on the mother board and a center opening for heat dissipation; a computer chip electrically connected to the sub PC board at the bottom and suspended above the mother board for letting heat be dissipated through the center opening on the sub PC board and the space between the computer chip and the mother board; and a heat conductive clamp bridged over two opposite sides of the sub PC board and clamped on two opposite sides of the computer chip for dissipating heat from the computer chip.
申请公布号 US5422790(A) 申请公布日期 1995.06.06
申请号 US19940198983 申请日期 1994.02.18
申请人 CHEN, PAO-CHIN 发明人 CHEN, PAO-CHIN
分类号 H01L23/40;H05K1/14;(IPC1-7):H05K7/20 主分类号 H01L23/40
代理机构 代理人
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