| 发明名称 |
HEAT-CURABLE BISMALEIMIDE MOLDING MATERIALS |
| 摘要 |
Heat-curable bismaleimide resins contain a bismaleimide and a heterocyclic comonomer having terminal alkenyl or alkenyloxy groups. A preferred comonomer is 2,6-bis-(2-propenylphenoxy)-pyridine. The bismaleimide resins are suitable for the production of high performance composites.
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| 申请公布号 |
CA1335856(C) |
申请公布日期 |
1995.06.06 |
| 申请号 |
CA19890607832 |
申请日期 |
1989.08.09 |
| 申请人 |
BASF AKTIENGESELLSCHAFT |
发明人 |
EISENBARTH, PHILIPP;LINDEN, GERD;ALTSTAEDT, VOLKER;ROLAND, PETER |
| 分类号 |
C08F216/12;B32B27/04;C07D213/69;C07D237/16;C08F16/32;C08F20/52;C08F222/40;C08G73/12;H01B1/24;(IPC1-7):C08F222/40 |
主分类号 |
C08F216/12 |
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