| 摘要 |
PURPOSE:To provide a method of forming the leads of an electronic part, where in the part can be reliably mounted on a circuit board by the above leads to enable a manufacturing facility to be enhanced in operating efficiency and lessened in product fraction defective. CONSTITUTION:The tips of the leads L and L of a product P are aligned with the chuck pawls 23 and 23 by the recesses 32 and 32 of a forming block 30, then the leads L and L are pushed against a first block 33 and so corrected in pitch as to make a lead pitch between them smaller than an interval A or a regular lead pitch between guide grooves 35 and 35. Then, the leads L and L are pushed against a second block 34 to be adjusted in lead pitch to make their pitch equal to an interval B between second guide grooves 36 and 36, whereby the leads L and L can be corrected to be arranged at a regular lead pitch. |
