发明名称 Precision high rate electroplating cell and method
摘要 A precision high rate electroplating cell comprising a rotating anode/jet assembly (RAJA) immersed in the electrolyte and having high pressure electrolyte jets aimed at the substrate (cathode). The high pressure jets facilitate efficient turbulent agitation at the substrate's surface, even when it consists of complex shapes or mask patterns. High aspect ratio areas receive similar degree of agitation (and replenishment) as areas of lower aspect ratios. As a result, thickness and composition micro-uniformities are substantially improved while utilizing significantly higher current densities and plating rates.
申请公布号 US5421987(A) 申请公布日期 1995.06.06
申请号 US19930113945 申请日期 1993.08.30
申请人 TZANAVARAS, GEORGE;COHEN, URI 发明人 TZANAVARAS, GEORGE;COHEN, URI
分类号 C25D5/02;C25D5/08;(IPC1-7):C25D3/56;C25D7/00 主分类号 C25D5/02
代理机构 代理人
主权项
地址