| 摘要 |
PURPOSE:To reduce the noise interference and cost of a burn-in board used at the time of testing semiconductor devices and to easily manufacture the board. CONSTITUTION:First to fifth substrates 23-27 respectively having lead-out patterns 33 and power supply surfaces on their both surfaces are arranged in a laminating state by dividing the substrates 23-27 into a signal system and power supply system. Then IC sockets 22 are mounted on the first substrate 23 by successively soldering the lead pins 31a-31e of the sockets 22 from the uppermost one in corresponding to the substrates 23-27 and cutting off unnecessary parts from the pins 31a-31e. |
