| 摘要 |
PURPOSE:To prevent a wire from being pulled off at the time of machining the capillary of a first bonding by bending the top of time wire. CONSTITUTION:A bonding wire 2, which is supplied through the center through- hole of a capillary 1, is set in a state that only one part of the wire is exposed from the top section 3 of the capillary. This exposed bonding wire 2 is bent in the lateral direction with a wire bending rod 4. After that, the capillary 1 is lowered toward an inner lead 5 and the top section 3 of the wire is press- fitted to the lead plane. Again, the capillary 1 is lifted to be moved over a semiconductor chip 6. And, after having reached to the upper limit, the capillary is lowered to be press-fitted to the semiconductor chip 6 so as to complete the bonding cycle. Thus. it is possible to realize the wedge bonding in all direction, thereby allowing a high-speed bonding. |
