| 摘要 |
PURPOSE:To prevent the generation of cracks by the difference in electric characteristics caused by the difference in workmanship, and thermal stress in the connection structure of a HIS module to be mounted and a substrate. CONSTITUTION:A part of the metal of a cylinder is notched, the inside diameter of the cylinder is smaller than the inside diameter of a HIC module, and as a result, the lead 2 of the HIC and a connection fitting 1 are supported by the springiness of the connection fitting. The HIC module and a substrate are electrically connected by soldering the circumference of the connection fitting 1 and the substrate 3. When the lead of the HIC module is expanded or contracted by heat, the lead is not subjected to stress by slipping in the connection fitting. |
