METHOD FOR SEALING LEAD FRAME AND SEMICONDUCTOR CHIP WITH RESIN

摘要

PURPOSE:To surely fix an IC chip by forming multiple IC chip retainers in nearly the same plane as that of outer leads formed in corresponding to multiple inner leads and using a lead frame which is formed as a die pad. CONSTITUTION:An opening 7 for mounting an IC chip S is formed at the center of a lead frame L. Multiple inner leads 1 which are extended so that the leads 1 can come on multiple electrode pads 8 formed on the surface of the chip S are provided so that the front end sections of the leads 1 can be faced to the opening 7 by mounting the chip S on the opening 7. In addition, outer leads 2 are formed in corresponding to the inner leads 1 and multiple chip retainers 5 are provided in nearly the same plane as that of the leads 1. Therefore, the chip S can be surely fixed with the retainers 5.