摘要 |
PURPOSE:To obtain a mirror surface for laminating a printed wiring board capable of perfectly removing the resinous foreign matter bonded to the surface of the mirror surface plate and an aligning through-hole by forming a resin film having a carboxyl group to the surface of the mirror surface plate having a flat surface provided with a positioning hole. CONSTITUTION:A metal flat plate having an aligning through-hole 2 provided to the periphery thereof is ground (belt grinding, buffing) to form a mirror surface plate. Subsequently, the mirror surface plate is immersed in an aq. soln. for electrodeposition of a resin having a carboxyl group to uniformly form a resin membrane 3 on the mirror surface plate and this mirror surface plate is washed and dried to obtain a mirror surface plate for laminating a printed wiring board. A prepreg and a multilayered wiring board material are laminated to hold the mirror surface plate and heated under pressure to obtain the printed wiring board. Since the resin membrane 3 on the surface of the mirror surface plate 1 and the resin membrane 3 in the through- hole 2 have the carboxyl group, the resin membrane 3 is saponified by the hydroxyl group of an aqueous alkali soln. to be hydrolyzed. Since a bonded resin is present on the resin membrane 2, the bonded resin can be perfectly removed by the decomposition and peeling of the resin membrane 3. |