发明名称 MIRROR SURFACE PLATE OF LAMINATING PRINTED WIRING BOARD AND PRODUCTION OF PRINTED WIRING BOARD USING THE SAME
摘要 PURPOSE:To obtain a mirror surface for laminating a printed wiring board capable of perfectly removing the resinous foreign matter bonded to the surface of the mirror surface plate and an aligning through-hole by forming a resin film having a carboxyl group to the surface of the mirror surface plate having a flat surface provided with a positioning hole. CONSTITUTION:A metal flat plate having an aligning through-hole 2 provided to the periphery thereof is ground (belt grinding, buffing) to form a mirror surface plate. Subsequently, the mirror surface plate is immersed in an aq. soln. for electrodeposition of a resin having a carboxyl group to uniformly form a resin membrane 3 on the mirror surface plate and this mirror surface plate is washed and dried to obtain a mirror surface plate for laminating a printed wiring board. A prepreg and a multilayered wiring board material are laminated to hold the mirror surface plate and heated under pressure to obtain the printed wiring board. Since the resin membrane 3 on the surface of the mirror surface plate 1 and the resin membrane 3 in the through- hole 2 have the carboxyl group, the resin membrane 3 is saponified by the hydroxyl group of an aqueous alkali soln. to be hydrolyzed. Since a bonded resin is present on the resin membrane 2, the bonded resin can be perfectly removed by the decomposition and peeling of the resin membrane 3.
申请公布号 JPH07144331(A) 申请公布日期 1995.06.06
申请号 JP19930293250 申请日期 1993.11.24
申请人 NEC CORP 发明人 TANAGANE OSAMU
分类号 B32B15/08;B29C43/18;B29C43/32;B29C63/26;B29K105/06;B29L31/34;H05K3/46;(IPC1-7):B29C43/32 主分类号 B32B15/08
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