| 摘要 |
PURPOSE:To reduce a gap between a stitch and the edge of a semiconductor element and to shorten a bonding wire by a method wherein the semiconductor element is inserted into an element mounting hole in a frame and an element mounting part is moved and scrubbed. CONSTITUTION:A fixation and bonding material 12 is arranged on the surface of an element mounting part 6 on a base 7. The element mounting part 6 on the base 7 is fitted to, and combined with, a guide hole 9 in a frame 4. The surface of a semiconductor element 3 is sucked and held, and the semiconductor element 3 is arranged in a semiconductor mounting hole 11. The base 7 is heated, and the fixation and bonding material 12 is melted. In a state that the frame 4 and the semiconductor element 3 have been held, the base 7 is turned and scrubbed so as to be made to creep between the back of the semiconductor mounting part 6 as well as between the element mounting part 6 and the guide hole 9. Metal interconnections 8 on a stitch 10 and the semiconductor element 3 are connected by bonding wires 2, the frame 4 and the base 7 as well as the frame 4 and a frame cover 1 are brought into close contact and fixed by an electric welding operation, and the inside is sealed airtightly.
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