发明名称 BONDING DEVICE
摘要 PURPOSE:To provide a bonding device provided with a frame extruder small- sized and able to cope with exchange of lead frame models while requiring almost no adjusting work by an operator at the time of model exchange so as to attain an improvement in work efficiency in addition to a small-sized device as a whole. CONSTITUTION:In relation to a supporting mechanism 84 reciprocally supporting a pusher 94 for extruding a frame L/F from a magazine M, and others, the magazine M is jointed with a control member 75 controlling in the direction of frame transmission so as to make the pusher 94 to approach the frame accompanying the operation of a controlling member 75.
申请公布号 JPH07147290(A) 申请公布日期 1995.06.06
申请号 JP19930316028 申请日期 1993.11.22
申请人 KAIJO CORP 发明人 TORIGOE AKIZOU
分类号 H01L21/60;H01L21/50 主分类号 H01L21/60
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