发明名称 Soldering device and solder dispenser
摘要 A soldering device includes a tube (1) for delivering a source of heating energy such as gas which is slidingly mounted in a chamber (52) such as a piston cylinder so that only the tube needs to be moved in order to move the heat source up and down with respect to a workpiece. Likewise, in a solder dispenser, the solder is supplied through a rigid tube (33) which may be slidingly mounted in a cylinder (52). The two may be used together in a combined soldering device/dispenser.
申请公布号 US5421504(A) 申请公布日期 1995.06.06
申请号 US19920986720 申请日期 1992.12.08
申请人 SPIRIG, ERNEST 发明人 SPIRIG, ERNEST
分类号 B23K1/00;B23K3/00;B23K3/02;B23K3/06;(IPC1-7):B23K1/00 主分类号 B23K1/00
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