发明名称 |
Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations |
摘要 |
This invention relates to electrodeposited copper foil having an elongation measured at 180 DEG C. in excess of about 5.5%, an ultimate tensile strength measured at 23 DEG C. in excess of about 60,000 psi, and a matte-side Rtm in the range of about 4.5 to about 18 mu m. This invention also relates to a process for making electrodeposited copper foil which comprises: preparing a copper deposition bath comprising water, copper ions and sulfate ions, said bath containing less than about 20 ppm chloride ions; and applying electric current to said bath to electrodeposit copper from said bath using a current density in the range of about 200 to about 3000 amps per square foot.
|
申请公布号 |
US5421985(A) |
申请公布日期 |
1995.06.06 |
申请号 |
US19920865791 |
申请日期 |
1992.04.07 |
申请人 |
GOULD INC. |
发明人 |
CLOUSER, SIDNEY J.;DIFRANCO, DINO F.;HASEGAWA, CRAIG J. |
分类号 |
H05K1/09;C25D1/04;C25D3/38;C25D7/06;H05K3/38;(IPC1-7):C25D1/04 |
主分类号 |
H05K1/09 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|