| 摘要 |
A heat sink apparatus includes a heat dissipation base made of material of high heat conductivity having a plate portion in tight contact engagement with a surface of an electronic device for conducting away heat generated by the electronic device. The plate portion has a number of spaced fins extending therefrom to surround a non-finned zone on the top surface of the plate portion. A retainer in the form of a hollow frame having an inner shoulder fit over a circumferential edge of the plate portion serves to fix the heat dissipation base to the electronic device by having resilient hooks of the retainer engage with a bottom edge of the electronic device. A fan assembly has a support plate with a central opening to be supported on the fins with the opening opposing the non-finned zone. A rotor/blade sub-assembly is rotatably supported on the support plate and partially received within the non-finned zone to rotate therein for generation of air flows through spacings between the fins and then expelled through the central opening to perform forced convection. The support plate has a plurality of resilient hooks formed thereon to releasably engage notches formed on the heat dissipation base for fixing the fan assembly on the heat dissipation base.
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