| 摘要 |
<p>PURPOSE:To prevent a tool from contacting with a temporary fixed or connected semiconductor chip when the semiconductor chip is temporary fixed or connected in a semiconductor device to be mounted by a face-down method. CONSTITUTION:After a semiconductor chip 1 of which the thickness of the semiconductor substrate is thin is mounted on a wiring board 3, a semiconductor chip 2 is mounted of which the thickness of the semiconductor substrate is thick. Thus, highly reliable and high density mounting is made possible.</p> |
