| 摘要 |
<p>PURPOSE:To reduce the package size of a surface mounting type semiconductor device and, at the same time, to separate the soldering surfaces of leads from a resin by using a shaped material for leads. CONSTITUTION:Each lead 2 is composed of a thick section 7 and thin section 7. The lead 2 is not bent, but kept in a plate-like state. An island section and the part of the lead 2 sealed with a resin 4 are constituted of the thin section 7. The thick section 6 is formed near the end of the lead 2 drawn out from the resin 4. The rear surface of the thick section 6 is nearly flushed with the rear surface of the resin 4. The rear surface of the thick section 6 becomes a soldering surface 8 and the surface 8 is separated from the resin 4.</p> |
