SUBSTRATE CUT-OUT PART DETECTION DEVICE IN SEMICONDUCTOR ALIGNER AND SUBSTRATE CUT-OUT PART DETECTION METHOD, AND RESIST EXPOSURE AMOUNT DECISION DEVICE AND RESIST EXPOSURE AMOUNT DECISION METHOD

摘要

PURPOSE:To provide a substrate cut-out part detection device in a semiconductor aligner which eliminates the need for what is called an edge aligner and a resist exposure amount decision device which enables decision of an optimum integration exposure amount in a substrate part which does not come into question in following various processes. CONSTITUTION:A substrate cut-out part detection device is comprised of a substrate cut-out part detection light source 1 which irradiates an edge part of a substrate 61 and exposes a resist layer 62 formed in an edge part of the substrate 61 and a photosensitive device 2 which receives light from a substrate cut-out part detection light source. A resist exposure amount decision device is comprised of a substrate edge part exposure light source which irradiates a substrate edge part and exposes a resist layer formed in a substrate edge part and a reflection light detection device which detects reflection light in a substrate edge part of exposure light from the substrate edge part exposure light source.