| 摘要 |
PURPOSE: To efficiently cool a semiconductor chip by providing a chi which is arranged on a member supporting the chip and removing heat from the top and reverse surfaces of the chip with a cooling liquid. CONSTITUTION: A cooling liquid is admitted into a module 60 through an intake 14 of an upper plate. The cooling liquid passes through a hole 68 of a gasket 22a and a hole 64 of a substrate 20a to ether a conduit region 38 of the substrate 20a. The cooling liquid flows over a chip package 50 of a substrate 20b. Then, the cooling liquid passes through a distribution hole 40a, to flow into a conduit 38 of the substrate 20b, and then the reverse surface of a chip package 50 and the top surface of the chi package 20c of a substrate 20c are cooled. The cooling liquid passes through a substrate 20c to cool the reverse surface of the chip package 50. Thus, the cooling liquid flows successively, from substrate to substrate through the module for removing heat from the top and reverse surfaces of the chip. |
