| 摘要 |
PURPOSE:To improve adhesibility and stripping property to the surface of a metal and flexibility by incorporating a specific high molecular compound, a photopolymerizable unsaturated compound and a photoinitiator. CONSTITUTION:This phtosensitive resin composition contains the high molecular compound obtained by copolymerizing 5-85 pts.wt. monomer (a) expressed by a formula, 15-30 pts.wt. vinyl monomer (b) having carboxyl group, 0-80 pts.wt. vinyl monomer (c) except (a) and (b) component by 100 pts.wt. sum of (a) to (c), the photopolymerizable unsaturated compound containing at least two ethylene group and the photoinitiator and this photosensitive film is obtained by laminating the layer of the photosensitive resin composition on a supporting film. In the formula I, R<1> is hydrogen atom, halogen atom or lower alkyl group, R<2> is 1-5C alkylene group, R<3> is expressed by formulas II-IV or V, R<4> is hydrogen atom, halogen atom or lower alkyl group and (n) is an integer of 1-23. |
