| 摘要 |
PURPOSE:To provide a molded semiconductor device which can be mounted on a board where a high frequency transmission line large in conductor width is provided for the connection with an external circuit. CONSTITUTION:A semiconductor chip (not shown in Figure) is mounted on a first metal member 2 with mounting solder such as Au, Sn or the like, the high frequency signal terminal of the semiconductor chip is bonded to a second metal member 1 with a metal wire (not shown in Figure) of Au or the like. The second metal member 1 is forked into center conductors 1a and 1b in a molded area. The center conductors 1a and 1b are sandwiched between two grounding conductors 2a and 2b of the first metal member 2. A space L2 between the grounding conductors 2a and 2b can be obtained from a formula, L2=3XP-M, and is 1.73mm long. As L2 is larger than the width B (1.3mm) of a conductor 10, the center conductors 1a and 1b can be mounted on the external conductor 10. |
