| 摘要 |
PURPOSE:To prevent the cut of bonding wires due to the cracking inside sealing resin, the exfoliation of inner leads from the resin, etc. CONSTITUTION:The tip of inner leads 2a of a lead frame 2 is made thin by eliminating a part of it by etching or other method. An LOC tape 3 is attached to the tip of the inner leads 2a and the rear face of the LOC tape 3 is attached to the front face of a semiconductor element. After pads 1a on the front face of the semiconductor element and the inner leads 2a are connected with gold wires 4, the semiconductor element is sealed with resin 5. |
