BOUNDARY ADHESION METHOD BETWEEN INSULATION MATERIALS

摘要

PURPOSE: To improve the adhesive strength of an interface between layers of insulating materials during the manufacture of an integrated circuit which has a multilayered structure. CONSTITUTION: For a method of improving the adhesion state of an interface between the insulating material layers during the manufacture of a semiconductor device, a 1st insulating layer 1 is formed of an insulating material on a circuit structure 7 which is formed on a substrate 6 of a semiconductor substrate, then a 2nd insulating layer 3 of an insulating material is out over the 1st insulating layer 1, and a thin oxide layer 2 is formed in an adhered state between the 1st and 2nd insulating layers 1 and 3. This inserted oxide layer 2 functions as an adhesion layer between the two superimposed insulating layers 1 and 3.