| 摘要 |
PURPOSE:To reduce a manufacturing manhours for a semiconductor device of a plastic PGA package structure and at the same time, to make it possible to attain a highly reliable electrical connection. CONSTITUTION:A semiconductor device is constituted of a substrate 1 supported penetratingly by a plurality of lead pins 3, a film circuit board 5 mounted on this substrate 1, an IC chip 12 mounted on this board 5 and a cap 16, which is attached on the substrate 1 and seals a package. In the board 5, wiring circuits 7a and 7b are respectively formed of a conductor foil on the surface and the rear of an insulative film 6, the wiring circuits on both surfaces of the surface and the rear are electrically connected to each other through a through hole 9, a bump 10 formed of one part of the wiring circuit on the surface is connected directly to an electrode 13 of the chip 12 and a pin connection part 11 formed of one part of the wiring circuit on the rear is connected to the pin 3. |
