| 摘要 |
PURPOSE:To increase the reliability of wire bonding by stabilizing the pressed and fastened condition of lead terminals on a lead frame. CONSTITUTION:In a pressure equipment which is provided with a heater block 1 which heats an island A1 on which a semiconductor element is mounted and a plurality of lead terminals A2 which are connected to the semiconductor element by abutting them and a pressing body 5 which moves down towards the heater block and which abuts each lead terminal, projections 4 which face the tip of the lead terminals are formed on the heater block when mounting the lead frame on the heater block. |
