| 摘要 |
<p>PURPOSE:To provide a multilayer wiring structure which has electro-migration resistance and stress-migration resistance and in which yield, reliability and surface flatness are improved. CONSTITUTION:First of all, a lower layer wiring 2 is formed on a substrate 1, and a contact wiring 3 for electrically connecting an upper and a lower wiring 2, 6 is formed, and after that, an insulating layer 4 is laminated on the whole surface of a substrate, and the surface of the insulating layer 4 is etched back until the surface of the contact wiring is exposed, and the upper wiring 6 is formed and connected with the exposed contact wiring 3.</p> |
