| 摘要 |
PURPOSE:To provide an inexpensive semiconductor integrated circuit device in which the main circuit section can be driven without requiring any DC power supply. CONSTITUTION:A main circuit section 2 of semiconductor integrated circuit chip being fed with DC power supply voltage is molded of resin or ceramics into a package and the lead terminals led out from this package are connected electrically with the terminals at the main circuit section 2 within the package. In such semiconductor integrated circuit device, a full-wave rectifying circuit 21 comprising a semiconductor integrated circuit is provided integrally with or independently from the main circuit section 2. Furthermore, the lead terminals 4A, 4B for input power supply led out from the package are connected electrically with the AC input terminals of the full-wave rectifying circuit 21 having DC output terminals connected electrically with the input terminals 3 of the main circuit section 2. |
