发明名称 COPPER-CLAD LAMINATED BOARD
摘要 <p>PURPOSE:To provide a composite copper-clad laminated board which has the improved tracking-resistance, is not influenced by the area ratio of a copper foil and, further, has excellent characteristics. CONSTITUTION:Woven glass cloths impregnated with thermosetting resin are laminated on both sides of a nonwoven glass cloth impregnated with thermosetting resin to obtain a substrate. Macrocrystalline electrolytic copper foils are applied to one of or both of the surfaces of the substrate with tracking-resistant adhesive layers therebetween.</p>
申请公布号 JPH07142831(A) 申请公布日期 1995.06.02
申请号 JP19930307009 申请日期 1993.11.15
申请人 MITSUI MINING & SMELTING CO LTD 发明人 KANAO YOSHINORI
分类号 B32B15/08;B32B37/06;H05K1/03;H05K3/38;(IPC1-7):H05K1/03;B32B31/26 主分类号 B32B15/08
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