发明名称 POLYMERIC COMPOSITIONS FOR MEDICAL PACKAGING AND DEVICES
摘要 <p>Multiple component polymer compositions for fabrication into articles. In particular, polymeric compositions comprising a heat resistant polymer; a radio frequency ('RF') susceptible polymer; a compatibilizing polymer; the composition having physical properties within the range a &lt; 40,000 psi; b » 70 %; c &lt; 30 %; d &gt; 1.0; e &lt; 0.1 %; f &lt; 0.1 %; g » 0.05; h « 60 %; i = 0; wherein: a is the mechanical modulus of the composition measured according to ASTM D-882; b is the percent recovery in length of the composition after an initial 20 % deformation; c is the optical haze of the composition being 9 mils in thickness according to ASTM D-1003; d is the lost tangent of the composition at 1 Hz measured at melt processing temperatures; e is the elemental halogen content by weight of the composition; f is the low molecular weight water soluble fraction of the composition; g is the dielectric loss between 1 and 60 MHz and over temperatures of 25 to 250 °C of the composition; h sample creep measured at 121 °C for a 1 inch strip of the composition under 27 psi loading; and, i indicates the composition exhibits no strain whitening after being strained at moderate speeds of about 20 inches (50 cm) per minute to about 100 % elongation (twice the original length) and the presence of strain whitening (indicated by 1) or lack thereof (indicated by 0) is noted.</p>
申请公布号 WO1995014739(A2) 申请公布日期 1995.06.01
申请号 US1994013342 申请日期 1994.11.16
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