The chip module includes at least one chip (4) arranged on a substrate material (1) and embedded in a moulded mass. On the opposite side of the chip to the substrate material is a lid (5) which at least partially covers the chip. In one embodiment the lid is in the form of a flat wafer which corresponds to the area of the chip to be covered and the associated contact connections. In a further embodiment the wafer has an edge region which projects beyond in the chip in the direction of the substrate material.
