发明名称 |
Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben. |
摘要 |
A ceramic package type semiconductor device (30, 50, 60, 70, 80) comprising: a ceramic substrate (32, 52, 72) having a wiring pattern layer (37, 57, 77) formed on a top surface thereof; at least one semiconductor element (31, 51a-51c, 71) mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring pattern layer; a metal cap (33, 53, 73) having at least one through-hole (33c, 53c1-53c6, 73c) corresponding to an external size of the semiconductor element and an end portion (33b, 53b, 73b) thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion (35a, 55a, 75) which is soldered to the flat plane of the metal cap (33, 53, 73) and the semiconductor element (31, 51, 71) to complete a hermetic sealing of the semiconductor element. |
申请公布号 |
DE69018846(D1) |
申请公布日期 |
1995.06.01 |
申请号 |
DE1990618846 |
申请日期 |
1990.02.08 |
申请人 |
FUJITSU LTD., KAWASAKI, KANAGAWA, JP |
发明人 |
SHIMIZU, NOBUTAKA, KAWASAKI-SHI, KANAGAWA 213, JP;TSUJIMURA, TAKEHISA, KAWASAKI-SHI, KANAGAWA 213, JP;SUGIMOTO, MASAHIRO, YOKOSUKA-SHI, KANAGAWA 237, JP;HARADA, SHIGEKI, MUSASHINO-SHI, TOKYO 180, JP |
分类号 |
H01L23/04;H01L23/057;H01L23/367;H01L23/498;(IPC1-7):H01L23/057 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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