Integrated circuit processing.

摘要

A microelectronic device prodn. method involves (a) mounting a wafer, contg. partially fabricated devices, on the adhesive side of a dicing tape; (b) subdividing the wafer to separate the devices which remain mounted on the dicing tape; (c) placing a protective cover over exposed portions of the adhesive side of the dicing tape; and (d) continuing fabrication of the separated devices with the protective cover in place. Also claimed are similar methods for fabricating a digital micromirror device and an accelerometer.