发明名称 Stamp device employing a heat sensitive stencil paper and a perforation process therefor.
摘要 <p>A stamp device (1) includes a stamp unit that can be designed in a compact size, of a light weight and having a low manufacturing cost while preventing ink leakage, and a thermal perforating device (50) that perforates the print face of the stamp unit. The stamp unit includes a grip portion (2), a stamp unit (3) that is fixedly linked to the grip portion, a skirt member (6) covering the outer peripheral side of the stamp unit, and a protection cap (7) that is freely detachably mounted on the stamp unit. The thermal perforating device for perforating the print face portion (33) of the stamp unit includes a body frame (51), a keyboard (52) that is provided at the front portion of the body frame and serves to input a perforation character array, a liquid crystal display (53) for displaying the input character array, a thermal perforating unit (54) provided at the rear portion of the body frame and into which the stamp unit is inserted, and a control unit (55) provided inside of the body frame. &lt;IMAGE&gt;</p>
申请公布号 EP0655342(A1) 申请公布日期 1995.05.31
申请号 EP19940308680 申请日期 1994.11.24
申请人 BROTHER KOGYO KABUSHIKI KAISHA 发明人 MIKI, TAKASHI;IMAMAKI, TERUO
分类号 B41C1/055;B41K1/32;B41L13/02;(IPC1-7):B41K1/32 主分类号 B41C1/055
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