发明名称 FLOOR MODULE
摘要 A floor module (M) is intended, together with a plurality of similar floor modules (M), to form a floor. The floor module consists of a rectangular bottom panel (1) and a substantially equally large, rectangular top panel (2), which is placed on and connected to the bottom panel (1). The panels (1, 2) are so diagonally offset in relation to each other that the bottom panel (1) forms a lower lip (3) extending outside two of the side edges of the top panel (2), while the top panel (2) forms an upper lip (4) extending outside the two opposed side edges of the bottom panel (1). Snap-coupling means (8 and 10) are arranged, respectively, at the upper side of the lower lip (3) and at the underside of the upper lip (4) to cooperate with corresponding snap-coupling means (10 and 8, respectively) on adjacent, similar floor modules (M) so as to form a releasable interconnection of the floor modules.
申请公布号 WO9514834(A1) 申请公布日期 1995.06.01
申请号 WO1994SE01084 申请日期 1994.11.17
申请人 TARKETT AB;RYDHOLM, GERT;PYLKKOENEN, AARRE 发明人 RYDHOLM, GERT;PYLKKOENEN, AARRE
分类号 E04F15/04;E04F15/22;(IPC1-7):E04F15/22 主分类号 E04F15/04
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