| 摘要 |
<p>PURPOSE:To reduce the area of a printed wiring board required for forming a printed circuit element by bonding a semiconductor element substrate with a conductor layer on the surface side of the printed wiring board, on both the surface and the back thereof conductor layers are shaped, and coating the surface of the semiconductor element substrate with a resin. CONSTITUTION:Copper-foil conductor layers 2, 21, 3, 31 are shaped onto the surface and back of an epoxy-resin laminated board 1, and connected with conductive paste 10 in holes 4, 5 for leading-out. A semiconductor element substrate 6 is fixed to the conductor layer 2, and an electrode 8 for the substrate 6 and the conductor layers 21 are connected by metallic small-gage wires 9. The assembled structure is sealed with epoxy resin 11, thus acquiring a printed circuit. With a parent printed substrate 12 on which a printed circuit element is mounted, it has a through-hole 14, from lower sections thereof engaging sections 13 are projected, and the back has conductor layers 16. The printed circuit element is inserted into the through-hole 14 for the substrate 12, and the conductor layers 31 and 16 are connected. Accordingly, the area of a printed wiring board required for forming the printed circuit element is reduced.</p> |
