BONDING METHOD FOR MOLDING,申请号JP19930307498-传众专利搜索

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发明名称	BONDING METHOD FOR MOLDING
摘要
申请公布号	JPH07138534(A)	申请公布日期	1995.05.30
申请号	JP19930307498	申请日期	1993.11.12
申请人	SANKYO SEIKI MFG CO LTD	发明人	MARUMO HIROMASA
分类号	C09J5/00;G11B7/22;(IPC1-7):C09J5/00	主分类号	C09J5/00
代理机构		代理人
主权项
地址

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