发明名称 FOAMED MOLDED BODY PREPARED BY MOLDING FOAMED CHIPS OF THERMOPLASTIC RESIN IN MOLD
摘要 PURPOSE:To obtain a large-sized foamed molded body being fusion-bonded uniformly, by a method wherein the relationship between a bulk volume and a true volume of foamed chips is made to meet a specific formula, the true volume after molding is increased to a prescribed multiple of the true volume before molding and the foamed particles are molded integrally with gaps formed, while an apparent volume is made a prescribed value or above. CONSTITUTION:A foamed molded body is obtained by a method wherein the relationship between a bulk volume V1 and a true volume V2 of foamed chips is made to meet the formula, the true volume of the foamed chips after molding is increased to be 1.7 to 3.2 times larger than the true value before molding and the foamed molded body is molded integrally so that gaps communicating with one another are formed, while an apparent volume of the body is made 0.2m<2> or above. In the formula, V1 denotes a value mm<3>/pcs. obtained by a method wherein the foamed chips of (ag) are filled in a measuring cylinder and vibrated and a volume mm<3> read from a scale when a constant weight is reached is divided by the number of pieces of the foamed chips, and V2 denotes a value mm<3>/pcs. obtained by dividing the volume of alcohol increased when the foamed chips of (ag) are sunk in the alcohol, by the number of pieces of the foamed chips. The apparent volume of the foamed chips equal to the dimensions of a mold cavity.
申请公布号 JPH07137064(A) 申请公布日期 1995.05.30
申请号 JP19930309780 申请日期 1993.11.16
申请人 JSP CORP 发明人 TOKORO TOSHIO;SHIOTANI AKIRA;HINOKAWA TERU
分类号 B29C44/00;B29K105/04;(IPC1-7):B29C44/00 主分类号 B29C44/00
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