发明名称 THERMOPLASTIC RESIN MOLD
摘要 PURPOSE:To form a very beautiful surface even if a specific molding material is not used without making a mold temperature high, by a method wherein a specific composite layer is provided on the surface of a mold cavity. CONSTITUTION:In a mold cavity, a composite layer which is comprised of a surface layer A and intermediate layer B is fitted to a mold basic material forming the mold cavity. The layer A is selected out of nickle, nickle-chromium steel, chromium, constantan, aluminum, copper, a copper-beryllium alloy and zinc. Then the layer is a metallic compound layer wherein a temperature conductivity is at least 300X10<-4>m<2>/h. The layer B is comprised of a layer possessing the melting point which is higher by at least 20 deg.C than a temperature of themoplastic resin under a molten condition, used for molding and has the temperature conductivity of not exceeding 50X10<-4>m<2>/h. Hereby, even if a glass fiber added material is used without extending a molding cycle, a glass fiber exposed on the product surface can be prevented and a molded product having an extremely excellent external appearance and strength is obtained.
申请公布号 JPH07137040(A) 申请公布日期 1995.05.30
申请号 JP19930289467 申请日期 1993.11.18
申请人 MITSUBISHI GAS CHEM CO INC 发明人 TAWARA HISASHI;IZUMIDA TOSHIAKI;YOSHIDA KATSUMI;KOBAYASHI MAKOTO
分类号 B29C33/38;B29K101/12;(IPC1-7):B29C33/38 主分类号 B29C33/38
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