Adhesive for printed wiring board and production thereof

摘要

An adhesive composition containing a special internal mold release agent obtained from tri-, di-, or mono-alkyl phosphoric ester, said alkyl moiety having 6 to 18 carbon atoms, and an amine in addition to major components of an epoxy resin, acrylonitrile-butadiene rubber, an alkylphenol resin, and an inorganic filler is suitable for producing printed wiring boards by an additive process excellent in adhesiveness to plated copper.