| 摘要 |
1,226,034. Integrated circuit module. AMP Inc. 23 July, 1969 [13 Sept., 1968], No. 43605/68. Heading H1R. [Also in Division H2] An integrated circuit module comprises a slab-like moulding 1 of dielectric material with projections 5 on opposed sides 2, being spaced apart along the sides and defining channels 4 extending through the thickness of the moulding, a circuit element encapsulated within the moulding and having its lead ends 6 and 7, contained within the moulding, a portion of each lead 8 intermediate the ends lying within a respective channel contiguous with the channel base. The module is received on a slab-like carrier (10) (Fig. 2, not shown) having two rows of electrically conductive posts (12) (Fig. 2, not shown) spaced apart longitudinally of the carrier, each post having a contact surface (14) (Fig. 2, not shown) substantially parallel to the channel base 4 of the module and in electrical contact with the intermediate portion of the lead 8 of the module. |
