| 摘要 |
Mounting for carrier bodies in an apparatus for the deposition of semiconductor material on heated carrier bodies, having a fixed current leadthrough passed through the base plate of the deposition apparatus, an electrode holder, and a graphite electrode. There is also at least one spring element which is disposed between the current leadthrough and the electrode holder, which permits a movement of the electrode holder relative to the current leadthrough and which cushions this movement. |
