| 摘要 |
The invention concerns a method of soldering large-area aluminum or aluminum-alloy plates to an iron-alloy workpiece. The soldering paste used consists of a flux containing about 50% of potassium fluoride and about 50% of aluminum fluoride, a soldering powder containing about 80 to 90% of aluminum and 20 to 10% of silicon, plus a polymethacrylate binder. In addition, the proportion of the flux lies between 40 and 60 wt %, that of the soldering powder between 60 to 40 wt % and that of the binder between 0.2 and 2 wt %.
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