| 摘要 |
The device reduces the effect of impedance in device operation by setting a float capacitor between a power pad (Vcc pad) and a ground pad (Vss pad), to settle the nosie problem of device by corresponding to the decrease of noise margin in low power device, and to enhance the speed of the device. This device comprises a semiconductor chip (1) which has various bond pads (1a), a lead frame (2) which takes many outleads (2b) (2c) and a paddle (2a) on which the semiconductor is set, a metal wire (3) which electrically connects the chip with the inner lead of the lead frame, and a float capacitor (10) which reduces power impedance effected by inductance and resistance when operating and is placed among the power pad, Vcc pad, and the ground pad, Vss pad, of the semiconductor chip.
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