Vacuum tight envelope with a heat sink for thermally - active semiconductor

摘要

Vacuum-tight heat sink for a s-c element with a high heat generation is of insulating material with a flat bottom on which the s-c element is mounted. The envelope contains at least one metallic heat conducting element vacuum-tightly sealed through the insulation bottom, and having an area on which the s-c element is mounted in a good thermal contact. The metal element is also fitted with a coupler for fastening the assembly to a carrier suitable for heat dissipation. The metallic element may be of a Fe-Ni-Co alloy with corresponding boron-silicate glass of appropriate heat expansion coefficient.